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Ajinomoto GX92R package substrate Manufacturer

2024-04-30 Новости компании / Новости / Уведомление / Новости торговли

Ajinomoto GX92R package substrate Manufacturer Ajinomoto GX92R package substrate Manufacturer and ABF package substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection ABF substrates and FC BGA substrates from 4 Кому 22 Слои. Ajinomoto GX92R package substrates represent the pinnacle of advanced semiconductor packaging…

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Showa Denko MCL-E-705G package substrate Manufacturer

2024-04-30 Новости компании / Новости / Уведомление / Новости торговли

Showa Denko MCL-E-705G package substrate Manufacturer Showa Denko MCL-E-705G package substrate Manufacturer. the MCL-E-705G core materials for the ABF BGA substrates, the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials. Showa Denko MCL-E-705G package substrates represent…

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Microwave/Microtrace PCB Manufacturer

2024-04-29 Новости компании / Новости / Уведомление / Новости торговли

Microwave/Microtrace PCB Manufacturer Microwave/Microtrace PCB Manufacturer.High speed and high frequency material packaging substrate Manufacturer. Advanced packaging substrate production process and technology Microwave/Microtrace PCBs are specialized printed circuit boards meticulously engineered for high-frequency applications, typically operating in the microwave frequency range. These PCBs are crafted with precision and care to ensure…

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RF Antenna substrate Manufacturer

2024-04-29 Новости компании / Новости / Уведомление / Новости торговли

RF Antenna substrate Manufacturer We are a professional RF Antenna substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. RF antenna substrates are vital components in wireless communication devices, supporting and constructing the radio frequency (RF) antenna system. They are specialized substrate materials,…

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Microtrace Substrate Manufacturer

2024-04-28 Новости компании / Новости / Уведомление / Новости торговли

Microtrace Substrate Manufacturer Microtrace Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing. Microtrace Substrates are advanced materials engineered to facilitate precise microscopic observations,…

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Military Substrate Manufacturer

2024-04-28 Новости компании / Новости / Уведомление / Новости торговли

Military Substrate Manufacturer Military Substrate Manufacturer and package substrate Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection substrates from 4 Кому 22 Слои, or other IPC Class III HDI Military PCBs from 4 layer to 108 Слои. Military substrates form the bedrock of modern…

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ШЭНЬЧЖЭНЬ QYC CO., LTD

В основном мы производим 2-слойную и 20-слойную упаковочную подложку, Минимальная трасса 9 мкм, Минимальный интервал 9 мкм. Лучшие самые маленькие размеры VIA - 50 мкм. Минимальный размер Pithc Bomp составляет 100 мкм. и большинство упаковочных материалов, которые мы используем, поставляются из Японии. Южная Корея.Качество материала основания очень стабильное.

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