Call: +086 0755 85241496 E-mail: service@qycltd.com

Technology Contact |

CompanyNews-Page46of307-Flip-ChipPackageSubstratemanufacturer-Page46

Company News

Home

Company News

What is a Flip Chip Package Substrate

2023-12-05 Company News / News / Notification / Trade News

Flip Chip Package Substrate Manufacturing .High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology

Read more
Ajimomoto Package Substrate

2023-12-04 Company News / News / Notification / Trade News

Ajimomoto Package Substrate Manufacturing. High speed material and Low CTE (Coefficient of Thermal Expansion). The Package Substrate CTE (Coefficient of Thermal Expansion) refers to the thermal expansion characteristics of the material used in the substrate of electronic packages. The substrate is a foundational component in electronic devices, providing a surface…

Read more
FCBGA Substrate Supply

2023-12-01 Company News / News / Notification / Trade News

FCBGA Substrate Supply. Introduction of Package substrate Materials. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

Read more
Build-up Structure FC-BGA|Organic Package

2023-11-30 Company News / News / Notification / Trade News

FC/BGA Structure Substrate Provider. FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.

Read more
Why is an organic substrate commonly used in electronic packaging?

2023-11-29 Company News / News / Notification / Trade News

Organic Package Substrates Maker. FC-BGA substrates are semiconductor packages with fine design rule and high reliability. QYC provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.

Read more
Build-up Structure FC-BGA

2023-11-28 Company News / News / Notification / Trade News

Build-up Structure FC-BGA Supply. We offers High Density Build Up (HDBU) substrates using ultra high density routing and 50 micron vias by using laser via formation and dry film resist lamination for high performance flip chip IC devices .

Read more

+086 0755 85241496

service@qycltd.com

Leave a message