Trade News

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  Embedded Cavity Substrate

  2024-02-15 Company News / News / Notification / Trade News

  Embedded Cavity Substrate Manufacturer, Cavity PCB production. We mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and  microtrace Cavity PCBs/Substrate.

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  Organic Packaging Substrate

  2024-02-14 Company News / News / Notification / Trade News

  Organic Packaging Substrate Manufacturing. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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  BGA Cavity Substrate

  2024-02-13 Company News / News / Notification / Trade News

  BGA Cavity Substrate Manufacturing and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 20 layers,

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  CSP package substrate Manufacturer

  2024-02-12 Company News / News / Notification / Trade News

  CSP package substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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  FCCSP Package Substrate

  2024-02-11 Company News / News / Notification / Trade News

  FCCSP Package Substrate Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

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  Wire Bonding Package Substrate

  2024-02-10 Company News / News / Notification / Trade News

  Wire Bonding Package Substrate Manufacturer, we mainly produce ultra-small bump pitch packaging substrate, ultra-small trace and spacing packaging substrate and microtrace HDI PCBs.

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