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Organic Substrate FC-BGA Design Guideline

2023-11-09 Company News / News / Notification / Trade News

Organic Substrate FC-BGA Design Guideline. Design rules of substrate in packaging and package substrate manufacturer. We use advanced Msap and Sap technology to produce the BGA substrates, High multilayer interconnection substrates from 4 to 20 layers,

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Package Substrate Material

2023-11-08 Company News / News / Notification / Trade News

Ceramic substrates and packages for electronic applications. the Package Substrate material will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials and high frequency materials.

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What is BT substrate?

2023-11-08 Company News / News / Notification / Trade News

BT Package Substrate Manufacturing .High speed and high frequency material packaging substrate manufacturer. Advanced Msap and Sap packaging substrate production process and technology.

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What are the rules for BGA substrate design?

2023-11-07 Company News / News / Notification / Trade News

BGA package substrate design rules. We are a professional bga package substrate production company, we mainly produce ultra-small bump pitch substrate from 2 layer to 20 layers., ultra-small trace and spacing packaging substrate and PCBs.

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What are the design considerations for BGA package substrates?

2023-11-07 Company News / News / Notification / Trade News

BGA(Ball Grid Array) Packages package substrate provider. Specialized in Msap and Sap production processes, we produce high multi-layer ultra-small trace FC BGA packaging substrates from 4 layers to 20 layers.

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What is a system in packaging SiP?

2023-11-06 Company News / News / Notification / Trade News

SIP package substrate manufacturer. we have produced the best samllest bump pitch with 100um, the microtrace are 9um. and the smallest gap are 9um. most of the design are 15um to 30um trace and spacing.

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