Call: +086 0755 85241496 E-mail: service@qycltd.com

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Flip-Chip Package Substrate manufacturer

Phone: +086 0755 85241496
E-mail: service@qycltd.com

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FCBGA package Substrate

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About us

SHENZHEN QYC CO.,LTD

We mainly produce 2-layer to 20-layer packaging substrate, minimum trace 9um, minimum spacing 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the packaging substrate materials we use come from Japan. South Korea.The material quality of the substrate is very stable.

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WLP Package Substrate

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CONTACT US

Phone: +086 0755 85241496

E-mail: service@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Business hours:Monday – Saturday 8.30am – 6pm

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

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