Call: +086 0755 85241496 E-mail: service@qycltd.com

Technology Contact |

Flip-Chip Package Substrate manufacturer

Phone: +086 0755 85241496
E-mail: service@qycltd.com

Menu

Home
Products
News
TECHNOLOGY
Contact
- Inquiry

Search

RogersPCB-Flip-ChipPackageSubstratemanufacturer

Rogers PCB

Home

Rogers PCB

2024-04-19 RO4350B PCB

News

Company News
Notification
Trade News

About us

SHENZHEN QYC CO.,LTD

We mainly produce 2-layer to 20-layer packaging substrate, minimum trace 9um, minimum spacing 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the packaging substrate materials we use come from Japan. South Korea.The material quality of the substrate is very stable.

QUICK LINKS

PRODUCTS

WLP Package Substrate

POP Package Substrate

CSP Package Substrate

SIP Package Substrate

SOP Package Substrate

PGA Package Substrate

CONTACT US

Phone: +086 0755 85241496

E-mail: service@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Business hours:Monday – Saturday 8.30am – 6pm

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

SEND MESSAGE TO US

Δ

Copyright © 2022 SHENZHEN QYC CO.,LTD All Rights Reserved.

About Us Contact Us Privacy Policy

+086 0755 85241496

service@qycltd.com

Leave a message

Δ