What is Rogers 4835T Substrate?

Rogers 4835T PCB Producer. Designed for use as inner-layers in multi-layer board (MLB) designs, RO4835T complements RO4835™ laminates when thinner cores are needed. RO4835T laminates feature high performance material attributes that provide an optimum blend of price, performance and durability with the capability of being fabricated using standard FR-4 (epoxy/glass) processes.

Features

• Dielectric constant (Dk) of 3.3
• Excellent oxidation resistance, compared to typical thermoset microwave materials
• Low loss, low CTE material
• Flame retardant laminate, UL 94 V-0 rated

Benefits

• CAF resistant
• Ease of PCB manufacturing and assembly in line with FR-4
• Minimizes local variation of dielectric constant
• Improved MLB design flexibility
• Improved design flexibility, PTH reliability and automated assembly compatibility

Rogers 4835T emerges as a high-frequency laminate substrate, playing a pivotal role in the construction of printed circuit boards (PCBs) tailored for RF (radio frequency) and microwave applications. It proudly holds its place within the esteemed RO4000® series of circuit materials meticulously crafted by Rogers Corporation.

Renowned for its exceptional characteristics, including a low dielectric constant and an impressively low loss tangent, the RO4000 series takes the spotlight in the realm of high-frequency designs. Specifically engineered for excellence, Rogers 4835T takes the lead in delivering outstanding electrical performance, extending its capabilities to frequencies soaring up to 40 GHz. Its versatile applications span across telecommunications, automotive radar systems, aerospace, and an array of high-frequency electronic devices.

The unique material properties of Rogers 4835T, characterized by its low dielectric constant and unwavering electrical performance across a wide frequency range, position it favorably in scenarios where preserving signal integrity and minimizing signal loss take precedence.

What Functions Does Rogers 4835T Substrate Serve?

Rogers 4835T substrate is a versatile workhorse in the realm of electronic applications, with a particular focus on RF (radio frequency) and microwave circuit design. Its functionalities span various dimensions:

Optimized for High Frequencies: Rogers 4835T takes the spotlight with its adeptness in delivering stellar electrical performance at high frequencies. This makes it a go-to choice for applications demanding seamless operation in the dynamic RF and microwave frequency domains.

Dielectric Dexterity: A standout attribute lies in its low dielectric constant, a key player in upholding signal integrity. The substrate’s low dielectric constant is instrumental in mitigating signal loss, ensuring the efficient flow of signals within high-frequency circuits.

Tackling Signal Attenuation: With a commendably low loss tangent, Rogers 4835T significantly contributes to minimizing signal attenuation. This quality proves indispensable in scenarios where maintaining the fidelity of signals is non-negotiable, as seen in telecommunications and radar systems.

Reliable Electrical Consistency: The substrate’s hallmark lies in its ability to consistently deliver unwavering electrical performance across a broad frequency spectrum. This reliability is paramount for applications that hinge on the stability and predictability of electronic signals.

Structural Backbone for PCBs: Beyond its electrical prowess, Rogers 4835T serves as the preferred laminate substrate material for the construction of Printed Circuit Boards (PCBs). It forms a robust structural foundation for electronic components and facilitates the seamless interconnection of various circuit elements.

Adaptability Across Industries: Its versatility shines through as it finds applications in diverse industries, ranging from telecommunications to automotive sectors (especially in radar systems), aerospace, and other arenas where high-frequency electronic devices play a pivotal role.

In essence, Rogers 4835T substrate emerges as a linchpin for high-frequency electronic circuits, combining a low dielectric constant, minimal signal attenuation, and steadfast electrical performance to cater to the dynamic and evolving needs of modern applications.

What Are the Different Types of Rogers 4835T Substrate?

Rogers 4835T takes its place within the expansive RO4000® series, a lineup of circuit materials meticulously crafted by Rogers Corporation. While Rogers 4835T stands out as a unique substrate within this series, it shares the stage with other types, each formulated to address specific performance benchmarks. Noteworthy members of the RO4000® series include:

RO4003C: Celebrated for its minimal dielectric loss, RO4003C finds its stride in applications where achieving high-frequency performance with negligible signal loss is a priority.

RO4350B: Defined by its low loss tangent and exceptional high-frequency capabilities, RO4350B is the substrate of choice for applications demanding both reliability and minimal signal loss.

RO4360G2: Tailored for multilayer circuit applications, RO4360G2 strikes a harmonious balance between electrical and thermal performance.

RO3003: Recognized for maintaining stable electrical performance at high frequencies, RO3003 is a preferred choice for applications like automotive radar systems.

RO3203: Crafted for high-frequency demands, RO3203 boasts low dielectric loss, making it effective in designs where preserving signal integrity is a critical consideration.

While these substrates share the common RO4000® series lineage, each type brings its own set of characteristics to the table, catering to the nuanced requirements of RF and microwave applications. The selection of a specific substrate hinges on the distinctive needs of the electronic design, encompassing factors such as frequency range, signal integrity objectives, and thermal considerations.

How Does Rogers 4835T Substrate Relate to IC Packaging?

In the intricate dance of IC (integrated circuit) packaging, Rogers 4835T substrate takes center stage, especially in arenas marked by high-frequency and RF (radio frequency) intricacies. The collaboration between Rogers 4835T and IC packaging unfolds through diverse facets:

Preferred Substrate Elegance: Rogers 4835T emerges as the substrate virtuoso in the theater of IC packages. These packages, not mere enclosures but vital players in achieving top-tier electrical performance, effective thermal equilibrium, and steadfast signal integrity, find an ideal companion in Rogers 4835T.

Sovereignty in High-Frequency Realms: Rogers 4835T’s pièce de résistance lies in its exceptional performance at the pinnacles of frequency. Particularly in the choreography of IC packaging for RF and high-frequency applications, the substrate’s role as a guardian of signal integrity and mitigator of signal loss becomes paramount. With its low dielectric constant and low loss tangent, Rogers 4835T steals the spotlight.

Championing Resilient Interconnections: The symphony of IC packaging often involves sophisticated techniques like wire bonding, orchestrating connections between the IC die and the package substrate. Rogers 4835T steps onto the stage as a stable and reliable foundation for various interconnect methods, ensuring a harmonious dance of connectivity and seamless signal transmission.

Silent Maestro in Thermal Dynamics: While not donning the mantle of a thermal management luminary, Rogers 4835T’s inherent properties and compatibility with other materials in the packaging ensemble contribute to the sonnet of thermal equilibrium. In the poetry of IC operation, effective thermal management becomes a vital stanza.

Specialized Ballet in Millimeter-Wave Productions: With its finesse in handling high frequencies, Rogers 4835T takes a leading role in the ballet of IC packaging for millimeter-wave devices. These devices, akin to avant-garde performances, demand nuanced packaging solutions, an arena where Rogers 4835T excels.

In essence, Rogers 4835T substrate elegantly waltzes into the tapestry of IC packaging, particularly in the theaters where high-frequency prowess, signal integrity, and reliability take the spotlight. Its presence choreographs the nuanced dance of functionality and performance in integrated circuits, especially in the dynamic arenas of RF and microwave technologies.

What Sets Rogers 4835T Substrate Apart from Traditional PCBs?

Rogers 4835T substrate is a departure from the norm of traditional PCBs, showcasing a unique set of features tailored explicitly for high-frequency applications. Here’s a fresh perspective on what makes it stand out:

Commanding High-Frequency Terrain: Rogers 4835T is purposefully engineered for peak performance at high frequencies, showcasing its prowess particularly up to 40 GHz. This sets it apart from conventional PCB materials that may struggle to navigate the intricate landscape of RF and microwave circuits.

Embracing a Modest Dielectric Constant: The substrate proudly flaunts a low dielectric constant, a critical attribute in the realm of high-frequency design. This modest value becomes a strategic advantage, adeptly minimizing signal loss and ensuring the seamless flow of signals. In contrast, traditional PCB materials, with potentially higher dielectric constants, grapple with the challenge of efficiently mitigating signal loss.

Championing a Frugal Loss Tangent: Rogers 4835T takes the lead with its frugal loss tangent, significantly contributing to the reduction of signal attenuation. Traditional PCB materials, grappling with higher loss tangents, concede to more pronounced signal loss, especially in the dynamic domain of high frequencies.

Consistency Across the Sonic Spectrum: Rogers 4835T maintains unswerving electrical performance across a sweeping frequency spectrum. This distinguishes it from traditional PCBs, which may showcase performance oscillations, particularly when confronted with the nuances of higher frequencies. The result is an elevated level of circuit reliability.

Tailored for Bespoke Applications: Rogers 4835T finds its sweet spot in applications that demand top-notch RF and microwave performance, such as in telecommunications, automotive radar systems, and aerospace. In contrast, traditional PCBs, though versatile, may find it challenging to deliver the same level of excellence in the intricate choreography of higher frequencies.

Crafted from an Exclusive Material Composition: Nestled within the esteemed RO4000® series of high-frequency laminates by Rogers Corporation, Rogers 4835T boasts an artful composition meticulously designed to shine in RF and microwave applications. Traditional PCBs often rely on commonplace materials like FR-4, which may fall short when facing the exacting demands of higher frequencies.

In essence, Rogers 4835T substrate emerges as a luminary in the realm of high-frequency design, marked by a low dielectric constant, frugal loss tangent, and unwavering electrical performance. Its focused application in demanding RF and microwave circuits distinguishes it in scenarios where safeguarding signal integrity takes center stage.

What is the Main Structure and Production Technology of Rogers 4835T Substrate?

Rogers 4835T substrate, a distinguished member of the RO4000® series tailored for high-frequency PCBs, boasts a well-structured composition and undergoes a meticulous production journey. Although specific details are proprietary, a general glimpse into its main structure and manufacturing processes reveals the following:

Strategic Copper Foil Integration: Copper foil layers play a pivotal role in Rogers 4835T, strategically positioned to conduct electrical signals. These layers form the intricate network of conductive traces and circuit patterns essential for high-frequency applications.

Central Core Layer: Anchored at the core is a specially engineered dielectric material, carefully selected for its low dielectric constant and low loss tangent. These characteristics are instrumental in ensuring optimal performance in the demanding realm of high frequencies.

Bonding Sheets for Unity: Facilitating the lamination process, bonding sheets or prepreg layers create a cohesive bond between the copper foils and the core layer. This strategic integration ensures structural integrity throughout the substrate.

Outer Surface Finish Refinement: The outer layers receive a finishing touch, such as ENIG or HASL. This surface finish not only shields against oxidation but also enhances solderability, contributing to the substrate’s overall functionality.

The production technology behind Rogers 4835T substrate involves a series of proprietary processes, highlighting the expertise of Rogers Corporation:

Precision Material Mixing: Raw materials undergo meticulous mixing to achieve the specific composition required for Rogers 4835T, adhering to a carefully formulated recipe.

Layer Stacking and Lamination: Layers, including copper foils, core layers, and bonding sheets, are stacked in a precise order. The lamination process, characterized by elevated temperature and pressure, forges a strong bond, creating a composite structure.

Curing for Endurance: The laminated structure undergoes a curing process to enhance stability and endurance, ensuring the substrate can withstand the challenges of its intended applications.

Drilling and Circuit Patterning: Precision drilling creates holes through the substrate, and advanced techniques like photolithography etch circuit patterns onto the copper layers, contributing to the substrate’s functional design.

Application of Surface Finish Expertise: A meticulous application of surface finish, tailored to the outer copper layers, adds the final touch, balancing protection and solderability.

Stringent Quality Evaluation: The finished product undergoes rigorous quality control assessments, ensuring it aligns seamlessly with the specified electrical and mechanical properties.

In essence, Rogers 4835T substrate reflects not just a structured composition, but a symphony of proprietary manufacturing processes, where each note contributes to its high-performance capabilities in the intricate landscape of high-frequency PCB applications.

Frequently Asked Questions (FAQs)

What are the main applications of Rogers 4835T PCB?

Rogers 4835T PCB finds applications in critical areas such as telecommunications, automotive radar systems, and aerospace. It is particularly suited for scenarios where reliable signal transmission and low signal loss at higher frequencies are essential.

What is the maximum frequency range supported by Rogers 4835T PCB?

Rogers 4835T PCB can proficiently handle frequencies up to 40 GHz. Its inherent low dielectric constant and low loss tangent contribute to its effectiveness in managing high-frequency signals.

Is Rogers 4835T PCB suitable for multilayer designs?

Yes, Rogers 4835T PCB is adaptable to multilayer configurations, making it versatile for diverse PCB designs, including those requiring intricate multilayer constructions for complex electronic systems.

How is Rogers 4835T PCB manufactured?

The manufacturing process involves precise material mixing, layer stacking, lamination under high temperature and pressure, curing, drilling, circuit patterning using advanced techniques, application of surface finish, and rigorous quality control measures.

Can Rogers 4835T PCBs be used for high-power applications?

While Rogers 4835T PCBs may handle moderate power levels, they are not specifically optimized for high-power applications. For such requirements, substrate

Conclusion

In summary, the Rogers 4835T PCB encapsulates excellence in the domain of high-frequency printed circuit boards. Its unique attributes, derived from the advanced properties of the Rogers 4835T substrate, position it as a standout performer in critical applications. By prioritizing the reduction of signal loss and ensuring robust signal integrity, especially in RF and microwave circuits, the Rogers 4835T PCB finds its niche in telecommunications, automotive radar systems, aerospace, and various other high-frequency applications.

Its adaptability to the demands of 5G applications underscores its relevance in the dynamic landscape of advanced communication systems. The impressive upper frequency limit of 40 GHz showcases its capability to handle high-frequency signals effectively, making it a dependable choice for cutting-edge technologies.

The versatility of the Rogers 4835T PCB extends to multilayer designs, demonstrating its ability to accommodate the intricacies of diverse PCB configurations. The manufacturing process, shrouded in proprietary precision, involves a carefully orchestrated series of steps, including material mixing, layer stacking, lamination, curing, drilling, circuit patterning, and stringent quality control measures.

While demonstrating proficiency in handling moderate power levels, it’s worth noting that the Rogers 4835T PCB isn’t explicitly designed for high-power applications. For such scenarios, substrates engineered with a focus on power handling capabilities may be more suitable.

In the context of lead-free assembly processes, the Rogers 4835T PCB seamlessly aligns with the requirements of lead-free soldering. The applied surface finish enhances solderability, aligning with manufacturers’ guidelines.

In essence, the Rogers 4835T PCB emerges as a sophisticated solution, blending state-of-the-art substrate technology with a diverse range of applications. Its journey, from precision manufacturing to practical deployment, reflects a commitment to excellence in the ever-evolving landscape of high-frequency electronics.